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General Information |
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Summary |
The powerful new Intel® Xeon® processor E5-2600 v4 product family offers versatility across diverse workloads. These processors are designed for architecting next-generation data centers running on, software defined infrastructure supercharged for efficiency, performance, and agile services delivery across cloud-native and traditional applications. They support workloads for cloud, high-performance computing, networking, and storage.
Performance
Built on 14 nm process technology, the Intel® Xeon® processor E5 v4 family offers up to 22 cores/44 threads per socket and 55 MB last-level cache (LLC) per socket for increased performance, as well as Intel® Transactional Synchronization Extensions (Intel® TSX) for increased parallel workload performance.
Optimized for Orchestration
Dynamically manage shared resources efficiently and increase resource utilization with Intel® Resource Director Technology (Intel® RDT) offering cache monitoring and allocation technology, code and data prioritization, and memory bandwidth monitoring.
Enhanced Security
Accelerated cryptographic performance enables encrypted data to move fast over secure connections, plus improved security keys help safeguard network access and deepen platform protection. |
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Processor |
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Processor family |
Intel® Xeon® E5 v4 |
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Processor frequency |
1.7 GHz |
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Processor cores |
6 |
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Processor socket |
LGA 2011-v3 |
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Component for |
Server/Workstation |
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Processor lithography |
14 nm |
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Box |
Y |
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Cooler included |
N |
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Processor model |
E5-2603V4 |
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Processor threads |
6 |
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System bus rate |
6.4 GT/s |
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Processor operating modes |
64-bit |
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Processor cache |
15 MB |
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Processor cache type |
Smart Cache |
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Number of QPI links |
2 |
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Processor codename |
Broadwell |
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Memory bandwidth supported by processor (max) |
59.7 GB/s |
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Processor ARK ID |
92993 |
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Memory |
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Memory channels |
Quad |
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Maximum internal memory supported by processor |
1536 GB |
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Memory types supported by processor |
DDR4-SDRAM |
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Memory clock speeds supported by processor |
1600,1866 MHz |
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Graphics |
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On-board graphics adapter |
N |
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Power |
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Thermal Design Power (TDP) |
85 W |
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Features |
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Execute Disable Bit |
Y |
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Idle States |
Y |
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Thermal Monitoring Technologies |
Y |
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Maximum number of PCI Express lanes |
40 |
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PCI Express slots version |
3.0 |
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PCI Express configurations |
1x16,1x4,1x8 |
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Supported instruction sets |
AVX 2.0 |
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Scalability |
2S |
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Physical Address Extension (PAE) |
46 bit |
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CPU configuration (max) |
2 |
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Embedded options available |
N |
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Processor special features |
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Intel® Hyper Threading Technology (Intel® HT Technology) |
N |
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Intel® Identity Protection Technology (Intel® IPT) |
N |
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Intel® Turbo Boost Technology |
N |
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Intel® vPro™ Technology |
Y |
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Intel Flex Memory Access |
N |
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Intel® AES New Instructions (Intel® AES-NI) |
Y |
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Enhanced Intel SpeedStep Technology |
Y |
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Intel Trusted Execution Technology |
Y |
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Intel VT-x with Extended Page Tables (EPT) |
Y |
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Intel Demand Based Switching |
Y |
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Intel® Secure Key |
Y |
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Intel TSX-NI |
Y |
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Intel® OS Guard |
Y |
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Intel 64 |
Y |
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Intel Virtualization Technology (VT-x) |
Y |
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Intel Virtualization Technology for Directed I/O (VT-d) |
Y |
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Conflict Free processor |
Y |
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Operational conditions |
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Tcase |
73 °C |
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Weight & dimensions |
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Processor package size |
45 x 52.5 mm |
