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General Information |
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Summary |
Intel® Xeon® Processor Scalable Family, Single Socket P (LGA 3647) supported, CPU TDP support 205W
Intel® C622 chipset
Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8x DIMM slots
Expansion slots:
1 PCI-E 3.0 x16,
1 PCI-E 3.0 x16 (x16 || x8),
1 PCI-E 3.0 x8 (x0 || x8),
1 PCI-E 3.0 x8,
1 PCI-E 3.0 x4 (in x8)
2 10GbE LAN ports
10 SATA3 (6Gbps) via C622
I/O: 1 VGA, 2 COM, TPM header
2 SuperDOM with built-in power
5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
M.2 NGFF connector |
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Processor |
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Processor manufacturer |
Intel |
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Processor thermal power (max) |
205 W |
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Memory |
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Supported memory types |
DDR4-SDRAM |
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Maximum internal memory |
1 TB |
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Memory voltage |
1.2 V |
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ECC сompatibility |
ECC |
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Supported memory clock speeds |
1600,1866,2133,2400,2666 MHz |
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Storage controllers |
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RAID levels |
0, 5, 10 |
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Internal I/O |
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USB 2.0 connectors |
6 |
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Rear panel I/O ports |
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USB 2.0 ports quantity |
6 |
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USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity |
5 |
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VGA (D-Sub) ports quantity |
1 |
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COM ports quantity |
2 |
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Network |
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Wi-Fi |
No |
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Ethernet LAN |
Yes |
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Ethernet interface type |
10 Gigabit Ethernet |
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Features |
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Motherboard form factor |
ATX |
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Expansion slots |
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PCI Express x8 (Gen 3.x) slots |
1 |
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PCI Express x16 (Gen 3.x) slots |
1 |
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BIOS |
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BIOS type |
UEFI AMI |
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ACPI version |
6.0 |
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Processor special features |
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Trusted Platform Module (TPM) |
Yes |
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Operational conditions |
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Storage temperature (T-T) |
-40 - 70 °C |
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Operating temperature (T-T) |
0 - 50 °C |
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Operating relative humidity (H-H) |
8 - 90% |
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Storage relative humidity (H-H) |
5 - 95% |
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Logistics data |
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Harmonized System (HS) code |
84733020 |
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Weight & dimensions |
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Width |
304.8 mm |
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Depth |
243.8 mm |
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Other features |
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PCI Express x4 (Gen 3.x) slots |
1 |
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Supported DIMM module capacities |
4GB, 8GB, 16GB, 32GB, 64GB, 128MB |
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Number of DIMM slots |
8 |
