General Information |
Summary |
Intel® Xeon® Processor Scalable Family, Single Socket P (LGA 3647) supported, CPU TDP support 205W Intel® C622 chipset Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8x DIMM slots Expansion slots: 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x16 (x16 || x8), 1 PCI-E 3.0 x8 (x0 || x8), 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 2 10GbE LAN ports 10 SATA3 (6Gbps) via C622 I/O: 1 VGA, 2 COM, TPM header 2 SuperDOM with built-in power 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers) M.2 NGFF connector |
Processor |
Processor manufacturer |
Intel |
Processor thermal power (max) |
205 W |
Memory |
Supported memory types |
DDR4-SDRAM |
Maximum internal memory |
1 TB |
Memory voltage |
1.2 V |
ECC |
Yes |
Supported memory clock speeds |
1600,1866,2133,2400,2666 MHz |
Storage controllers |
RAID levels |
0, 5, 10 |
Internal I/O |
USB 2.0 connectors |
6 |
Rear panel I/O ports |
USB 2.0 ports quantity |
6 |
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity |
5 |
VGA (D-Sub) ports quantity |
1 |
COM ports quantity |
2 |
Network |
Wi-Fi |
No |
Ethernet LAN |
Yes |
Ethernet interface type |
10 Gigabit Ethernet |
Features |
Motherboard form factor |
ATX |
Expansion slots |
PCI Express x16 (Gen 3.x) slots |
1 |
BIOS |
BIOS type |
UEFI AMI |
ACPI version |
6.0 |
Processor special features |
Trusted Platform Module (TPM) |
Yes |
Operational conditions |
Storage temperature (T-T) |
-40 - 70 °C |
Operating temperature (T-T) |
0 - 50 °C |
Operating relative humidity (H-H) |
8 - 90% |
Storage relative humidity (H-H) |
5 - 95% |
Logistics data |
Harmonized System (HS) code |
84733020 |
Weight & dimensions |
Width |
304.8 mm |
Depth |
243.8 mm |
Other features |
PCI Express x4 (Gen 3.x) slots |
1 |
PCI Express x8 (Gen 3.x) slots |
1 |
Supported DIMM module capacities |
4GB, 8GB, 16GB, 32GB, 64GB, 128MB |
Number of DIMM slots |
8 |