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General Information |
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Summary |
Improve the Heat Transfer between a CPU and Heatsink through a Ceramic/Silicone Compound
The HEATGREASE20 CPU Thermal Paste Compound can be used to improve the effectiveness of a CPU cooler, by thermally bonding the surface of the CPU to the heatsink, which enables the heatsink and fan to work more efficiently to remove harmful heat from the CPU.
This 20g tube of ceramic-based thermal grease is enough for a large number of CPU installations for most home or business computers or any other light application where good thermal bonding between two surfaces is required.
Please see our support section for the Material Safety Data Sheet for HEATGREASE20. |
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Features |
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Thermal conductivity |
1.066 W/m·K |
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Product colour |
White |
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Thermal resistance |
0.195 °C/W |
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Specific gravity |
2.3 g/cm³ |
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Operating temperature (T-T) |
-20 - 100 °C |
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Storage temperature (T-T) |
-50 - 100 °C |
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Operating relative humidity (H-H) |
10 - 80% |
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Technical details |
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Evaporation (@ 200°C/24h) |
0.001% |
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Bleed (@ 200°C/24h) |
0.005% |
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Compliance certificates |
RoHS |
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Weight & dimensions |
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Width |
72 mm |
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Depth |
18 mm |
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Height |
18 mm |
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Weight |
24 g |
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Packaging data |
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Package width |
79 mm |
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Package depth |
147 mm |
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Package height |
21 mm |
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Package weight |
37 g |
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Logistics data |
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Master (outer) case width |
434 mm |
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Master (outer) case length |
345 mm |
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Master (outer) case height |
349 mm |
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Products per master (outer) case |
230 pc(s) |
